Viscom S3088 SPI

Viscom S3088 SPI – Solder Paste Inspection

• High speed solder paste inspection
• High resolution to 15µm/pixel
• Easy, fast Program Creation
• Flexible, Powerful Programming with vVision software
• Offline programming for maximum utilisation
• Viscom uplink with AOI/AXI

Defect Coverage:

Insufficient solder
Solder bridge/short circuit
Smearing of paste
Y placement

Excessive solder
Contamination
Paste shape defect
Rotation

Missing solder
Offset print
X placement
Form defect

Optional:

Surface inspection

OCR

Brochure

Viscom S3088 SPI