Viscom S3088 SPI – Solder Paste Inspection
• High speed solder paste inspection
• High resolution to 15µm/pixel
• Easy, fast Program Creation
• Flexible, Powerful Programming with vVision software
• Offline programming for maximum utilisation
• Viscom uplink with AOI/AXI
Defect Coverage:
Insufficient solder
Solder bridge/short circuit
Smearing of paste
Y placement
Excessive solder
Contamination
Paste shape defect
Rotation
Missing solder
Offset print
X placement
Form defect
Optional:
Surface inspection
OCR